Virtual Silicon Announces High-Speed Interface IP Product Line
Silicon Ready Circuits Provide High-Speed Interfaces to Industry Standard Busses
SUNNYVALE, Calif.--(BUSINESS WIRE)--Nov. 5, 2001--Virtual Silicon
Technology Inc., a leader in semiconductor intellectual property,
today announced the introduction of their new high-speed
eSi-Interface(TM) IP product line for the use in system-on-chip (SoC)
design. The eSi-Interface products provide the critical link for
chip-to-chip communications for such applications as networking,
computing, wireless communications, peripheral interface, portable
electronics and graphics. The first silicon proven members of the
family include USB1.1, SSTL-2 (class II), and Advanced Graphic Port
(AGP/4X) solutions. Virtual Silicon is developing Interface products
in 0.18 micron, 0.15-micron, 0.13 micron and 0.10 micron process
technologies.
"Virtual Silicon interface IP is already working in our PCI5110
UMTS/3G baseband processor which has just been released to our
customers," said Mark Bapst, director of SoC development at
PrairieComm Inc. "High speed data and other specialized interfaces are
becoming increasingly ubiquitous in both communications and computing
applications, including PrairieComm's 3G digital wireless baseband
solutions. Virtual Silicon's expertise in designing high-speed
interface IP allowed us to meet our performance and ESD specifications
with first pass silicon."
"As faster and faster SoC are developed, the need for reliable
high-speed chip-to-chip communication has become critical," said John
Ford, vice president of marketing for Virtual Silicon. "Virtual
Silicon is committed to meet the demand for the growing number of
industry standard bus interfaces and new high-speed memory bus
architectures with a comprehensive, Silicon Ready® product line."
The Silicon Ready Program
Silicon Ready status indicates that the circuits were tested in
real silicon by Virtual Silicon on one of its many test chips, and by
customers in a production SoC. eSi-Interface products that are Silicon
Ready include IP for industry standard bus connections USB1.1 (0.18
micron), SSTL-2 (0.15 micron), and AGP4X (0.15 micron). They also
include crystal oscillators designed to operate at 32Khz and the
14-28Mhz range. eSi-Interface products are pitch and power ring
compatible with Virtual Silicon's eSi-Pad(TM) I/O products and
eSi-PLL(TM) phased locked loops in either inline or staggered formats
for 0.18 micron, 0.15 micron, and/or 0.13 micron. Current users of
Virtual Silicon's eSi-Pad and eSi-PLL products can seamlessly
incorporate eSi-Interface products into their designs.
Availability and Pricing
Other eSi-Interface products that will be available for the above
process technologies before the end of the year include USB1.1,
USB2.0, PCI-2.2, PCI-X, LVDS (622 MHz), HSTL (Class I & II), and
SSTL-2 (Class II). eSi-Interface products may be licensed directly
from Virtual Silicon with list prices from $40,000 to $300,000.
About Virtual Silicon Technology
Virtual Silicon is a leading supplier of semiconductor
intellectual property and process technology to manufacturers and
designers of complex systems-on-chip (SoC). Headquartered in
Sunnyvale, CA, the company provides process-specific embedded
components that serve the wireless, networking, graphics,
communication and computing markets. Customers include leading fabless
semiconductor companies, integrated semiconductor manufacturers,
foundries and SoC developers who demand leading edge technology for
their semiconductor innovations. For more information, call (408)
548-2700 or visit Virtual Silicon online at www.virtual-silicon.com.
Note to Editors: eSi-Interface, Silicon Ready, and Virtual Silicon
are trademarks of Virtual Silicon Technology, Inc.
Contact:
Virtual Silicon Technology
John Ford, 408/548-2737
johnf@virtual-silicon.com
or
VitalCom Marketing and PR
Lou Covey, 650/637-8212 x202
lou@vitalcompr.com
